Impinj, Inc., a provider of RAIN RFID solutions, recently introduced the Impinj M730 and Impinj M750 integrated circuits, the first tag chips in the company’s family. The Impinj M730 and M750 ICs deliver high performance, fast inventory capability and advanced features for next-generation RAIN RFID tags that can be embedded in nearly any item and that operate worldwide.
The Impinj M730 and M750 ICs deliver increased sensitivity to enable the development of small, universal RAIN RFID tags. The new ICs also allow retailers to operate their RAIN RFID readers faster than with other tag chips, reducing inventory time. Features also include frictionless self-checkout and embedded tagging with product returns.
“Today we achieved a significant milestone by offering the Impinj M730 and M750 endpoint ICs to our global inlay partners,” said Chris Diorio, CEO of Impinj. “These ICs represent our most significant endpoint IC innovation since we introduced our first tag chip in 2005 and they portend a future of Impinj innovation and technology advancements that I believe will enable extending the Internet of Things to every thing—from clothing to food to luggage and beyond.”
The Impinj M730 IC has 128-bit EPC memory. The Impinj M750 IC has 96-bit EPC memory and 32-bit user memory. Both new Impinj ICs provide increased sensitivity, improved readability, advanced features, and are compatible with the GS1 UHF Gen2v2 protocol which ISO/IEC standardized as 18000-63. Impinj is now taking orders for the Impinj M730 and M750 ICs with expected delivery starting in the first quarter of 2020. Samples of these ICs are available to all Impinj inlay partners. New products based on the Impinj M730 and M750 ICs are expected over the coming months from leading RAIN RFID inlay manufacturers.
About Impinj
Impinj wirelessly connects billions of everyday items such as apparel, medical supplies, and automobile parts to consumer and business applications such as inventory management, patient safety, and asset tracking. The Impinj platform uses RAIN RFID to deliver timely information about these items to the digital world, thereby enabling the Internet of Things.
